Due to the mixed nature of the chip industry, many chips find their way into the market through various channels. Our primary task at Citrusglow Electronics is to prevent these chips from circulating in the market. Our goal is to ensure that no counterfeit chips reach our customers. Years of experience have led us to develop several effective testing solutions.

  • Functional Testing



    Functional testing refers to the various necessary logic or signal status tests conducted under normal working conditions of the device at room temperature. This testing is based on the original equipment manufacturer's specifications, as well as industry standards or regulations. Feasible test vectors or dedicated test circuits are designed to apply appropriate signal source inputs to the test samples, assessing the functional characteristics of the device.

  • External Visual Inspection


    The appearance test refers to the examination of the sample surface, silk screen, packaging, and dimensions under a microscope, in accordance with relevant standards, to determine compliance with specification requirements. Additionally, it involves verifying whether the pins are oxidized and assessing co-planarity.

  • X-ray testing



    X-ray testing is a rapid and effective method for analyzing internal defects in non-destructive samples. It involves the use of high voltage to generate X-rays that penetrate through the target material, allowing for the inspection of internal structures, quality of electronic components, semiconductor packaging products, and various types of solder joints in SMT (Surface Mount Technology).

  • Acetone Testing



    The acetone test involves systematically wiping the silk screen on the positive surface of the chip with a certain concentration of acetone. The results are used to determine whether the chip surface has been reprinted; if the testing swab turns black, the test is considered unsuccessful.

  • Solderability Testing



    According to the relevant standards for solderability testing, we simulate the on-machine process of the chip to determine whether the tin coating on the chip pins meets the requirements of soldering standards. This is done to assess whether the sample pins can be properly soldered. Our advantage lies in our ability to support solderability testing for all packages, including BGA, and simulate SMT temperature curve soldering tests, providing quick response results.